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S-Bond™ Joining
S-Bond™ is revolutionary new joining technology based on patented
active solder alloys and processing methods. S-Bond™ alloys
are lead-free with the advantages listed below. Its market potential
lies in that it is a metallic joining compound that can join most
inorganic materials in an economic, low temperature, one-step joining
process. Market applications include the joining of thermal management
devices due to high thermal conductivity, the joining electronic
packages that are now utilizing new ceramics and composite materials,
as well as a host of other joining applications where adhesives
or conventional solders have not worked.
S-Bond™ joining is based on MRi's patented active solder
technologies that encompass a range of active solder alloys and
processing methods that activate the S-Bond™ alloys. S-Bond™
alloys join:
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· at low temperature (<450ºC) |
· without flux |
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· in air |
· without metallization |
The alloys are not conventional solders or brazes… but are
active solder alloys that have reactive elements added that enable
the molten solder to directly wet and bond to oxides and other
ceramic-like substrates or layers that typically exist on many
corrosion resistance metals, such as aluminum, titanium and/or
stainless steels. These active solder alloys do not flow, therefore;
techniques to distribute these solders are integrated into S-Bond™
methods. These techniques overcome the alloys' low capillary flow
and prevent the molten solder from infiltrating interconnected
porosity in foams that typically could absorb high capillary brazes
and solders.
S-Bond™ has been shown to be able to join:
| · all metals |
· most ceramics |
| · glasses |
· metal matrix composites |
Refer to the appropriate sections of this website and contact
us if you need additional information regarding your application.
Also please see our Literature
Download Center for additional product, technical and application
information.
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