S-Bond™ Joining Applications

The advantages and capabilities of S-Bond™ technology enable it to be considered for a wide range of applications. S-Bond™ alloys can join many materials and is very effective in dissimilar material joints, including:

S-Bond™ is an active solder provides a metallic, thermally and electrically conductive joint that is tough and has sufficient ductility to joining many dissimilar materials. It is a lower temperature joining process as compared to brazing (used for example in joining aluminum alloys and in metal-to-glass or ceramic joints) and may offer advantages when joining larger thermal expansion (CTE) mismatch materials. It is a lead free alternative joining materials and flux-free process with no volatile organics (V.O.C.'s) or long cure time. Premetallizations are also not required on many joints, providing an economic advantage over multi-step solder joining. With these advantages, S-Bond™ joining is finding applications in:

· Refrigeration components · Sputter targets · Automotive electronic packaging · Precision high-speed equipment · Electrical insulators · Sensors · Die Attachment

Please refer to our Literature Download Center for additional and new applications. Many new applications are emerging…