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WideGap Joining: Powder Preform Techonology for Joining Dissimilar Materials
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S-Bond™ Purchases

S-Bond™ joining is a combination of unique alloy formulations and processing methods. S-Bond™ alloys are technically solders, however, since the joining processes are fluxless and do not use not metallizations, they differ from conventional soldering. The easiest way to get introduced to S-Bond™ joining is to call us and share your application specifications with us and we can make recommendations.

MRi offers a variety of means to meet your S-Bond™ requirements.

- kits, materials, equipment to support your needs

- demonstration, testing or production joining
- integral solutions for production requirements
- Terms and Conditions of Sale

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Home | About Materials Resources International (MRi) | MRi Technologies for Joining Dissimilar Materials | Product Applications
S-Bond™ : Fluxless Low Temperature Joining
|
WideGap™ Joining : Powder Preform Technology for Joining Dissimilar Materials
|
BrazeCoatŪ : Metallurgically Bonded Carbide Coatings/Claddings

Literature Download Center
  | Purchase Center | Inquiries | Site Guide 

 

Materials Resources International
811 W. Fifth Street
Lansdale, PA 19446 USA
Tel: (215) 631-7111 Fax: (215) 631-7115

Web: www.MaterialsResources.com
e-mail: rsmith@materialsresources.com